 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| www..com Freescale Semiconductor Technical Data Document Number: MHVIC2115NR2 Rev. 5, 5/2006 RF LDMOS Wideband Integrated Power Amplifier The MHVIC2115NR2 wideband integrated circuit is designed for base station applications. It uses Freescale's newest High Voltage (26 to 28 Volts) LDMOS IC technology and integrates a multi - stage structure. Its wideband On - Chip matching design makes it usable from 1600 to 2600 MHz. The linearity performances cover W - CDMA modulation formats. Final Application * Typical W - CDMA Performance: - 45 dBc ACPR, 2110 - 2170 MHz, VDD = 27 Volts, IDQ1 = 56 mA, IDQ2 = 61 mA, IDQ3 = 117 mA, Pout = 34 dBm, 3GPP Test Model 1, Measured in 1.0 MHz BW @ 4 MHz offset, 64 DTCH Power Gain -- 30 dB PAE = 16% Driver Application * Typical W - CDMA Performance: - 53 dBc ACPR, 2110 - 2170 MHz, VDD = 26 Volts, IDQ1 = 96 mA, IDQ2 = 204 mA, IDQ3 = 111 mA, Pout = 23 dBm, 3GPP Test Model 1, Measured in 3.84 MHz BW @ 5 MHz offset, 64 DTCH Power Gain -- 34 dB * Gain Flatness = 0.3 dB from 2110 - 2170 MHz * P1dB = 15 Watts, Gain Flatness = 0.2 dB from 2110 - 2170 MHz * Capable of Handling 3:1 VSWR, @ 26 Vdc, 2140 MHz, 15 Watts CW Output Power Features * Characterized with Series Equivalent Large - Signal Impedance Parameters * On - Chip Matching (50 Ohm Input, DC Blocked, >5 Ohm Output) * Integrated Temperature Compensation with Enable/Disable Function * Integrated ESD Protection * RoHS Compliant * In Tape and Reel. R2 Suffix = 1,500 Units per 16 mm, 13 inch Reel. Table 1. Maximum Ratings Rating Drain- Source Voltage Gate- Source Voltage Storage Temperature Range Operating Junction Temperature Symbol VDSS VGS Tstg TJ MHVIC2115NR2 2170 MHz, 26 V, 23/34 dBm W - CDMA RF LDMOS WIDEBAND INTEGRATED POWER AMPLIFIER 16 1 CASE 978 - 03 PFP - 16 Value - 0.5, +65 - 0.5, +15 - 65 to +150 150 Unit Vdc Vdc C C N.C. VGS3 VGS2 VGS1 Quiescent Current Temperature Compensation VGS3 VGS2 VGS1 RFin RFin IC VDS3/RFout RFin VDS1 VDS2 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 N.C. VDS3/RFout VDS3/RFout VDS3/RFout VDS3/RFout VDS3/RFout VDS3/RFout N.C. VDS1 VDS2 3 Stages IC (Top View) Note: Exposed backside flag is source terminal for transistors. Figure 1. Block Diagram Figure 2. Pin Connections (c) Freescale Semiconductor, Inc., 2006. All rights reserved. MHVIC2115NR2 1 RF Device Data Freescale Semiconductor Table 2. Thermal Characteristics Characteristic Thermal Resistance, Junction to Case Driver Application (Pout = +0.2 W CW) Output Application (Pout = +2.5 W CW) Stage 1, 26 Vdc, IDQ = 96 mA Stage 2, 26 Vdc, IDQ = 204 mA Stage 3, 26 Vdc, IDQ = 111 mA Stage 1, 27 Vdc, IDQ = 56 mA Stage 2, 27 Vdc, IDQ = 61 mA Stage 3, 27 Vdc, IDQ = 117 mA Symbol RJC 3.5 Value Unit C/W 2.7 Table 3. ESD Protection Characteristics Test Conditions Human Body Model Machine Model Charge Device Model Class 1 (Minimum) M1 (Minimum) C2 (Minimum) Table 4. Moisture Sensitivity Level Test Methodology Per JESD 22 - A113, IPC/JEDEC J - STD - 020 Rating 3 Package Peak Temperature 260 Unit C Table 5. Electrical Characteristics (TC = 25C unless otherwise noted) Characteristic Symbol Min Typ Max Unit W - CDMA Characteristics (In Freescale Test Fixture, 50 ohm system) VDD = 26 Vdc, IDQ1 = 96 mA, IDQ2 = 204 mA, IDQ3 = 111 mA, Pout = 23 dBm, 2110- 2170 MHz Power Gain Gain Flatness Input Return Loss Group Delay Phase Linearity 1 - Carrier W - CDMA Conditions: Adjacent Channel Power Ratio @ Pout = 23 dBm, 5 MHz Offset 1 - Carrier W - CDMA Conditions: Adjacent Channel Power Ratio @ Pout = 28 dBm, 5 MHz Offset Gps GF IRL -- -- ACPR ACPR 31 -- -- -- -- -- -- 34 0.3 - 12 1.7 0.2 - 53 - 50 -- 0.5 - 10 -- -- - 50 -- dB dB dB ns dBc dBc W - CDMA Characteristics (In Freescale Test Fixture, 50 ohm system) VDD = 27 Vdc, IDQ1 = 56 mA, IDQ2 = 61 mA, IDQ3 = 117 mA, Pout = 34 dBm, 2110- 2170 MHz Power Gain Gain Flatness Input Return Loss Power Added Efficiency 1 - Carrier W - CDMA Conditions: Adjacent Channel Power Ratio @ Pout = 34 dBm, 4 MHz Offset Gps GF IRL PAE ACPR -- -- -- -- -- 30 0.2 - 12 16 - 45 -- -- -- -- -- dB dB dB % dBc MHVIC2115NR2 2 RF Device Data Freescale Semiconductor 1 Vbias3 R3 Vbias2 R2 Vbias1 R1 RF INPUT 16 + C1 C2 3 C3 2 15 C15 14 + C5 4 13 C16 RF OUTPUT C9 + C14 C4 5 12 6 VD1 Quiescent Current Temperature Compensation 11 VD3 10 C17 C18 + C21 VD2 + C8 C7 C6 7 + C19 + C20 + C13 + C12 C11 C10 8 9 C1, C5, C8, C12, C14, C19 C2, C3, C4, C7, C11, C18 C6, C10, C17 C9, C15, C16 1 mF SMT Tantalum Chip Capacitors 0.01 mF Chip Capacitors (0805C103K5RACTR) 6.8 pF Chip Capacitors, ACCU - P (AVX 08051J6R8BBT) 1.8 pF Chip Capacitors, ACCU - P (AVX 08051J1R8BBT) C13, C20, C21 330 mF Electrolytic Capacitors (MCR35V337M10X16) R1, R2, R3 1 kW Chip Resistors (0805) PCB Arlon, 0.020,, er = 2.55 Figure 3. MHVIC2115NR2 Demo Board Schematic MHVIC2115NR2 RF Device Data Freescale Semiconductor 3 Vbias1 R1 Vbias2 R2 Vbias3 R3 VGS C2 C14 C5 C1 MHVIC2115R2 Rev 1 C4 VG1 VG2 VG3 C3 C15 C9 C6 C16 C10 C7 C12 C8 C21 VDD1 C11 C13 VDD2 C17 C18 C19 C20 VDD3 Freescale has begun the transition of marking Printed Circuit Boards (PCBs) with the Freescale Semiconductor signature/logo. PCBs may have either Motorola or Freescale markings during the transition period. These changes will have no impact on form, fit or function of the current product. Figure 4. MHVIC2115NR2 Demo Board Component Layout MHVIC2115NR2 4 RF Device Data Freescale Semiconductor TYPICAL CHARACTERISTICS 50 40 30 S21 (dB) 20 10 0 -10 VDD = 27 Vdc, Pout = 23 dBm CW S11 S21 0 -5 -10 DELAY, (nSEC) -15 -20 -25 -30 S11 (dB) 1.8 1.6 1.4 1.2 -30_C 1 0.8 0.6 0.4 0.2 0 2100 VDD = 27 Vdc, Pout = 23 dBm CW IDQ1 = 96 mA, IDQ2 = 204 mA, IDQ3 = 111 mA 2110 2120 2130 2140 2150 2160 2170 2180 IDQ1 = 96 mA, IDQ2 = 204 mA, IDQ3 = 111 mA -20 -35 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 f, FEQUENCY (MHz) TC = 85_C 25_C f, FREQUENCY (MHz) Figure 5. Broadband Frequency Response Figure 6. Delay versus Frequency 40 39 G ps , POWER GAIN (dB) 38 37 36 35 34 33 32 31 30 2100 VDD = 27 Vdc, Pout = 23 dBm CW IDQ1 = 96 mA, IDQ2 = 204 mA, IDQ3 = 111 mA 2110 2120 2130 2140 2150 2160 2170 2180 25_C TC = -30_C IRL, INPUT RETURN LOSS (dB) 20 15 TC = 85_C 25_C -30_C 10 85_C 5 VDD = 27 Vdc, Pout = 23 dBm CW IDQ1 = 96 mA, IDQ2 = 204 mA, IDQ3 = 111 mA 0 2100 2110 2120 2130 2140 2150 2160 2170 2180 f, FREQUENCY (MHz) f, FREQUENCY, (MHz) Figure 7. Power Gain versus Frequency Figure 8. Input Return Loss versus Frequency 40 39 38 G ps , POWER GAIN (dB) 37 36 25_C 35 34 33 32 31 30 20 VDD = 27 Vdc, f = 2140 MHz IDQ1 = 96 mA, IDQ2 = 204 mA, IDQ3 = 111 mA 25 30 35 40 45 85_C 70 65 TC = -30_C TC = 25_C S21 PHASE(_) 60 -30_C 55 50 85_C 45 40 20 VDD = 27 Vdc, f = 2140 MHz IDQ1 = 96 mA, IDQ2 = 204 mA, IDQ3 = 111 mA 25 30 35 40 45 Pout, OUTPUT POWER (dBm) Pout, OUTPUT POWER (dBm) Figure 9. Power Gain versus Output Power Figure 10. S21 Phase versus Output Power MHVIC2115NR2 RF Device Data Freescale Semiconductor 5 TYPICAL CHARACTERISTICS ACPR, ADJACENT CHANNEL POWER RATIO (dBc) -40 -42 -44 -46 IMR (dBc) -48 -50 -52 -54 -56 -58 -60 15 17 19 21 23 25 27 29 2140 MHz 2170 MHz 2110 MHz VDD = 27 Vdc 3GPP Test Model 1 64 DPCH -40 -45 -50 -55 3rd Order -60 -65 5th Order 33 35 -70 2000 2050 2100 2150 122 mA 2200 2250 2300 111 mA 100 mA VDD = 27 Vdc Pout = 23 dBm Two-Tone Avg. Tone Spacing = 100 kHz IDQ3 = 100 mA 122 mA 31 Pout, OUTPUT POWER (dBm) f, FREQUENCY (MHz) Figure 11. W - CDMA ACPR versus Output Power Figure 12. Two - Tone IMR versus Frequency IMD, INTERMODULATION DISTORTION (dBc) -50 -52 -54 -56 -58 -60 -62 -64 -66 -68 -70 0 5 10 15 20 25 TONE SPACING (MHz) VDD = 27 Vdc, f = 2140 Pout = 23 dBm, Two-Tone Avg. 5th Order 3rd Order Vbias, FIXTURE BIAS VOLTAGE (V) 6.00 5.75 5.50 5.25 5.00 4.75 4.50 4.25 4.00 3.75 3.50 3.25 3.00 -40 -30 -20 -10 VBIAS3 VDD = 27 Vdc R1 = R2 = R3 = 1000 Ohms VBIAS1 VBIAS2 0 10 20 30 40 50 60 70 80 90 100 T, TEMPERATURE (C) Figure 13. Two - Tone Broadband Performance Figure 14. Fixture Bias versus Temperature 4.20 4.10 Vgs, IC GATE BIAS VOLTAGE (V) 4.00 3.90 3.80 3.70 3.60 3.50 3.40 3.30 3.20 -40 -30 -20 -10 0 10 20 30 40 Igs3 Vgs3 VDD = 27 Vdc R1 = R2 = R3 = 1000 Ohms Vgs1 & Vgs2 Igs1 & Igs2 2.00 1.80 Igs, GATE BIAS CURRENT (mA) 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 50 60 70 80 90 100 T, TEMPERATURE (C) Figure 15. Gate Bias versus Temperature MHVIC2115NR2 6 RF Device Data Freescale Semiconductor Zo = 50 f = 2170 MHz Zload f = 2110 MHz f = 2170 MHz Zin f = 2110 MHz VDD = 27 Vdc, IDQ = 1411 mA, Pout = 15 W Avg. f MHz 2110 2140 2170 Zin Zin 72.55 + j12.8 71.40 + j9.9 70.20 + j7.1 Zload 4.25 + j1.00 4.13 + j1.37 4.12 + j1.46 = Device input impedance as measured from gate to ground. Zload = Test circuit impedance as measured from drain to ground. Device Under Test Output Matching Network Z in Z load Figure 16. Series Equivalent Input and Load Impedance MHVIC2115NR2 RF Device Data Freescale Semiconductor 7 NOTES MHVIC2115NR2 8 RF Device Data Freescale Semiconductor NOTES MHVIC2115NR2 RF Device Data Freescale Semiconductor 9 NOTES MHVIC2115NR2 10 RF Device Data Freescale Semiconductor PACKAGE DIMENSIONS h X 45 _ A E2 1 16 NOTES: 1. CONTROLLING DIMENSION: MILLIMETER. 2. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 PER SIDE. DIMENSIONS D AND E1 DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 5. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION IS 0.127 TOTAL IN EXCESS OF THE b DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-. MILLIMETERS MIN MAX 2.000 2.300 0.025 0.100 1.950 2.100 6.950 7.100 4.372 5.180 8.850 9.150 6.950 7.100 4.372 5.180 0.466 0.720 0.250 BSC 0.300 0.432 0.300 0.375 0.180 0.279 0.180 0.230 0.800 BSC --- 0.600 0_ 7_ 0.200 0.200 0.100 14 x e D e/2 D1 8 9 E1 8X B BOTTOM VIEW E CB S bbb Y A A2 M b1 c C DATUM PLANE SEATING PLANE H SECT W - W L1 ccc C q W W L 1.000 0.039 DETAIL Y A1 GAUGE PLANE CASE 978 - 03 ISSUE C PFP - 16 RF Device Data Freescale Semiconductor CCC EE CCC EE b aaa M c1 CA S DIM A A1 A2 D D1 E E1 E2 L L1 b b1 c c1 e h q aaa bbb ccc MHVIC2115NR2 11 How to Reach Us: Home Page: www.freescale.com E - mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1 - 800- 521- 6274 or +1 - 480- 768- 2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1 - 8 - 1, Shimo - Meguro, Meguro - ku, Tokyo 153 - 0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1 - 800- 441- 2447 or 303 - 675- 2140 Fax: 303 - 675- 2150 LDCForFreescaleSemiconductor@hibbertgroup.com RoHS-compliant and/or Pb- free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb- free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale.s Environmental Products program, go to http://www.freescale.com/epp. Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2006. All rights reserved. RoHS- compliant and/or Pb - free versions of Freescale products have the functionality and electrical characteristics of their non - RoHS- compliant and/or non - Pb- free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale's Environmental Products program, go to http://www.freescale.com/epp. MHVIC2115NR2 Rev. 12 5, 5/2006 Document Number: MHVIC2115NR2 RF Device Data Freescale Semiconductor |
Price & Availability of MHVIC2115NR2
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |